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Pushing the Limit of Power Density in Devices with Ultra-Wide Bandgap (All-AlGaN) Heterostructures.
ข้อมูลเนื้อหา
Pushing the Limit of Power Density in Devices with Ultra-Wide Bandgap (All-AlGaN) Heterostructures.
자료유형  
 학위논문
Control Number  
0017164893
International Standard Book Number  
9798346380771
Dewey Decimal Classification Number  
620
Main Entry-Personal Name  
Noshin, Maliha.
Publication, Distribution, etc. (Imprint  
[S.l.] : Stanford University., 2024
Publication, Distribution, etc. (Imprint  
Ann Arbor : ProQuest Dissertations & Theses, 2024
Physical Description  
112 p.
General Note  
Source: Dissertations Abstracts International, Volume: 86-05, Section: A.
General Note  
Advisor: Chowdhury, Srabanti.
Dissertation Note  
Thesis (Ph.D.)--Stanford University, 2024.
Summary, Etc.  
요약The increasing energy-consumption due to increased electrification of our society is pushing the limit of today's power-electronics systems. To address this challenge, the development of higher energy-density power-electronic devices and systems will be a key enabler of energy technologies for future grid-electronics and data centers. To this end, ultrawide-bandgap (UWBG) semiconducting materials-like aluminum gallium nitride (AlGaN) are emerging as promising candidates for high-power electronics, beyond the limitations of conventional materials like silicon.In this thesis, I will present the first demonstration of nitrogen (N)-polar AlGaN (Al = 20% to 73%) heterostructure based high-electron mobility transistors. First, I will discuss the compositional design space and metal organic chemical vapor deposition (MOCVD)-growth of such heterostructures to realize a tunable and large bandgap, followed by the materials characterization. I will simultaneously explain how the alloy-dominated scattering of charge carriers in such material system can control its two-dimensional electron gas mobility. Leveraging these fundamental understanding, I will demonstrate the realization of the first N-polar AlGaN-channel high electron mobility transistors, achieving simultaneously large drive current, low contact resistance, low leakage current and large breakdown voltage. Finally, I will illustrate the interface-driven thermal and electrical transport and their temperature dependence in such heterostructures, offering important insights into material-device codesign, electronic device functionality and reliability. This work demonstrates the outstanding potential of AlGaN-based heterostructures for high-power density electronic devices and systems.
Subject Added Entry-Topical Term  
Silicon.
Subject Added Entry-Topical Term  
Electrons.
Subject Added Entry-Topical Term  
Optimization techniques.
Subject Added Entry-Topical Term  
Electric fields.
Subject Added Entry-Topical Term  
Electric vehicles.
Subject Added Entry-Topical Term  
Signal processing.
Subject Added Entry-Topical Term  
Microscopy.
Subject Added Entry-Topical Term  
Etching.
Subject Added Entry-Topical Term  
Aluminum.
Subject Added Entry-Topical Term  
Transistors.
Subject Added Entry-Topical Term  
Heat conductivity.
Subject Added Entry-Topical Term  
Nitrogen.
Subject Added Entry-Topical Term  
Atomic physics.
Subject Added Entry-Topical Term  
Electrical engineering.
Subject Added Entry-Topical Term  
Electromagnetics.
Subject Added Entry-Topical Term  
Thermodynamics.
Subject Added Entry-Topical Term  
Transportation.
Added Entry-Corporate Name  
Stanford University.
Host Item Entry  
Dissertations Abstracts International. 86-05A.
Electronic Location and Access  
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Control Number  
joongbu:655947
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