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Non-Destructive Analysis of Ic Bond Pad Structures Using Signal Processing of Acoustic Emission Signatures and Finite Element Analysis.
Non-Destructive Analysis of Ic Bond Pad Structures Using Signal Processing of Acoustic Emission Signatures and Finite Element Analysis.
상세정보
- 자료유형
- 학위논문
- Control Number
- 0016620816
- International Standard Book Number
- 9798357512628
- Dewey Decimal Classification Number
- 300
- Main Entry-Personal Name
- Liu, Chen.
- Publication, Distribution, etc. (Imprint
- [S.l.] : Stanford University., 2022
- Publication, Distribution, etc. (Imprint
- Ann Arbor : ProQuest Dissertations & Theses, 2022
- Physical Description
- 160 p.
- General Note
- Source: Dissertations Abstracts International, Volume: 84-05, Section: B.
- General Note
- Advisor: Senesky, Debbie;Cai, Wei;Gu, Wendy.
- Dissertation Note
- Thesis (Ph.D.)--Stanford University, 2022.
- Restrictions on Access Note
- This item must not be sold to any third party vendors.
- Subject Added Entry-Topical Term
- Load.
- Subject Added Entry-Topical Term
- Finite element analysis.
- Subject Added Entry-Topical Term
- Energy.
- Subject Added Entry-Topical Term
- Algorithms.
- Subject Added Entry-Topical Term
- Clustering.
- Subject Added Entry-Topical Term
- Cracks.
- Subject Added Entry-Topical Term
- Graphene.
- Subject Added Entry-Topical Term
- Acoustic emission testing.
- Subject Added Entry-Topical Term
- Thin films.
- Subject Added Entry-Topical Term
- Sensors.
- Subject Added Entry-Topical Term
- Signal processing.
- Subject Added Entry-Topical Term
- Acoustics.
- Subject Added Entry-Topical Term
- Computer science.
- Subject Added Entry-Topical Term
- Condensed matter physics.
- Subject Added Entry-Topical Term
- Electrical engineering.
- Subject Added Entry-Topical Term
- Materials science.
- Subject Added Entry-Topical Term
- Physics.
- Added Entry-Corporate Name
- Stanford University.
- Host Item Entry
- Dissertations Abstracts International. 84-05B.
- Host Item Entry
- Dissertation Abstract International
- Electronic Location and Access
- 로그인을 한후 보실 수 있는 자료입니다.
- Control Number
- joongbu:627036
MARC
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■020 ▼a9798357512628
■035 ▼a(MiAaPQ)AAI29756163
■040 ▼aMiAaPQ▼cMiAaPQ
■0820 ▼a300
■1001 ▼aLiu, Chen.
■24510▼aNon-Destructive Analysis of Ic Bond Pad Structures Using Signal Processing of Acoustic Emission Signatures and Finite Element Analysis.
■260 ▼a[S.l.]▼bStanford University. ▼c2022
■260 1▼aAnn Arbor▼bProQuest Dissertations & Theses▼c2022
■300 ▼a160 p.
■500 ▼aSource: Dissertations Abstracts International, Volume: 84-05, Section: B.
■500 ▼aAdvisor: Senesky, Debbie;Cai, Wei;Gu, Wendy.
■5021 ▼aThesis (Ph.D.)--Stanford University, 2022.
■506 ▼aThis item must not be sold to any third party vendors.
■590 ▼aSchool code: 0212.
■650 4▼aLoad.
■650 4▼aFinite element analysis.
■650 4▼aEnergy.
■650 4▼aAlgorithms.
■650 4▼aClustering.
■650 4▼aCracks.
■650 4▼aGraphene.
■650 4▼aAcoustic emission testing.
■650 4▼aThin films.
■650 4▼aSensors.
■650 4▼aSignal processing.
■650 4▼aAcoustics.
■650 4▼aComputer science.
■650 4▼aCondensed matter physics.
■650 4▼aElectrical engineering.
■650 4▼aMaterials science.
■650 4▼aPhysics.
■690 ▼a0791
■690 ▼a0986
■690 ▼a0984
■690 ▼a0611
■690 ▼a0544
■690 ▼a0794
■690 ▼a0605
■71020▼aStanford University.
■7730 ▼tDissertations Abstracts International▼g84-05B.
■773 ▼tDissertation Abstract International
■790 ▼a0212
■791 ▼aPh.D.
■792 ▼a2022
■793 ▼aEnglish
■85640▼uhttp://www.riss.kr/pdu/ddodLink.do?id=T16620816▼nKERIS▼z이 자료의 원문은 한국교육학술정보원에서 제공합니다.
■980 ▼a202302▼f2023
