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Materials for high-density electronic packaging and interconnection- [electronic resource]
Materials for high-density electronic packaging and interconnection- [electronic resource]
- Material Type
- 단행본
- 0008535179
- Date and Time of Latest Transaction
- 20030109193644.0
- ISBN
- 0585143951 (electronic bk.)
- DDC
- 621.381/046-20
- Callnumber
- 621.381 N277m
- 단체저자
- National Research Council (U.S.) Committee on Materials for High-Density Electronic Packaging
- Title/Author
- Materials for high-density electronic packaging and interconnection - [electronic resource]
- Publish Info
- Washington, D.C. : National Academy Press, 1990.
- Material Info
- xiv, 139 p : ill. ; 28 cm.
- General Note
- Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
- General Note
- Available from Defense Technical Information Center, Cameron Station.
- General Note
- "NMAB-449."
- 서지주기
- Includes bibliographical references.
- Reproduction Note
- Electronic reproduction. . Boulder, Colo. : NetLibrary, 2000. Available via the World Wide Web. Available in multiple electronic file formats. Access may be limited to NetLibrary affiliated libraries.
- Subject Added Entry-Topical Term
- Electronic packaging Materials
- Added Entry-Corporate Name
- NetLibrary, Inc.
- Additional Physical Form Entry
- . Original. 030904233X. (DLC) 90060385. (OCoLC)21437247
- Electronic Location and Access
- 로그인을 한후 보실 수 있는 자료입니다.
- Control Number
- joongbu:100411
Detail Info.
- Reservation
- 캠퍼스간 도서대출
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